CVE-2025-21458 - Use After Free in NPU

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HIGH

Use After Free in NPU

Published Aug 6, 2025

7.8

HIGH

CVSS 3.1

EPSS 0.09%

Description

Memory corruption when IOCTL interface is called to map and unmap buffers simultaneously.

Affected products

Vendor Qualcomm, Inc. Product Snapdragon Default
unaffected
- Version
  FastConnect 6900
  Status
  affected
  Constraints
  -
- Version
  QAM8255P
  Status
  affected
  Constraints
  -
- Version
  QAM8650P
  Status
  affected
  Constraints
  -
- Version
  QAM8775P
  Status
  affected
  Constraints
  -
- Version
  QCA6174A
  Status
  affected
  Constraints
  -
- Version
  QCA6698AQ
  Status
  affected
  Constraints
  -
- Version
  QCA6797AQ
  Status
  affected
  Constraints
  -
- Version
  SA7255P
  Status
  affected
  Constraints
  -
- Version
  SA7775P
  Status
  affected
  Constraints
  -
- Version
  SA8255P
  Status
  affected
  Constraints
  -
- Version
  SA8620P
  Status
  affected
  Constraints
  -
- Version
  SA8650P
  Status
  affected
  Constraints
  -
- Version
  SA8775P
  Status
  affected
  Constraints
  -
- Version
  SA9000P
  Status
  affected
  Constraints
  -
- Version
  SW5100
  Status
  affected
  Constraints
  -
- Version
  SW5100P
  Status
  affected
  Constraints
  -
- Version
  Snapdragon 888 5G Mobile Platform
  Status
  affected
  Constraints
  -
- Version
  Snapdragon 888+ 5G Mobile Platform (SM8350-AC)
  Status
  affected
  Constraints
  -
- Version
  WCD9380
  Status
  affected
  Constraints
  -
- Version
  WCD9385
  Status
  affected
  Constraints
  -
- Version
  WCN3980
  Status
  affected
  Constraints
  -
- Version
  WCN3988
  Status
  affected
  Constraints
  -
- Version
  WSA8830
  Status
  affected
  Constraints
  -
- Version
  WSA8835
  Status
  affected
  Constraints
  -

Default status is the baseline for the product, each version can override it (e.g. patched versions marked unaffected).

Vendor

Product

Default status

Versions

Qualcomm, Inc.

Snapdragon

unaffected

Version	Status	Constraints
FastConnect 6900	affected	-
QAM8255P	affected	-
QAM8650P	affected	-
QAM8775P	affected	-
QCA6174A	affected	-
QCA6698AQ	affected	-
QCA6797AQ	affected	-
SA7255P	affected	-
SA7775P	affected	-
SA8255P	affected	-
SA8620P	affected	-
SA8650P	affected	-
SA8775P	affected	-
SA9000P	affected	-
SW5100	affected	-
SW5100P	affected	-
Snapdragon 888 5G Mobile Platform	affected	-
Snapdragon 888+ 5G Mobile Platform (SM8350-AC)	affected	-
WCD9380	affected	-
WCD9385	affected	-
WCN3980	affected	-
WCN3988	affected	-
WSA8830	affected	-
WSA8835	affected	-

Remediation

No remediation recorded yet.

Weaknesses (1)

CWE-416

Use After Free

References (2)

https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html
PatchVendor Advisory
https://euvd.enisa.europa.eu/vulnerability/EUVD-2025-23806
Advisory

Link	Providers	Tags
https://docs.qualcomm.com/product/publicresources/securitybulletin/august-2025-bulletin.html		PatchVendor Advisory
https://euvd.enisa.europa.eu/vulnerability/EUVD-2025-23806		Advisory