CVE-2022-33263 - Use after free in Core

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HIGH

Use after free in Core

Published Jun 6, 2023

7.8

HIGH

CVSS 3.1

EPSS 0.11%

Description

Memory corruption due to use after free in Core when multiple DCI clients register and deregister.

Affected products

Vendor Qualcomm, Inc. Product Snapdragon Default
unaffected
- Version
  AQT1000
  Status
  affected
  Constraints
  -
- Version
  FastConnect 6200
  Status
  affected
  Constraints
  -
- Version
  FastConnect 6700
  Status
  affected
  Constraints
  -
- Version
  FastConnect 6900
  Status
  affected
  Constraints
  -
- Version
  FastConnect 7800
  Status
  affected
  Constraints
  -
- Version
  QAM8255P
  Status
  affected
  Constraints
  -
- Version
  QCA6420
  Status
  affected
  Constraints
  -
- Version
  QCA6430
  Status
  affected
  Constraints
  -
- Version
  QCA6574AU
  Status
  affected
  Constraints
  -
- Version
  QCA6595AU
  Status
  affected
  Constraints
  -
- Version
  QCA6698AQ
  Status
  affected
  Constraints
  -
- Version
  QCA6797AQ
  Status
  affected
  Constraints
  -
- Version
  QCS8155
  Status
  affected
  Constraints
  -
- Version
  SA6155P
  Status
  affected
  Constraints
  -
- Version
  SA8155P
  Status
  affected
  Constraints
  -
- Version
  SA8195P
  Status
  affected
  Constraints
  -
- Version
  SA8255P
  Status
  affected
  Constraints
  -
- Version
  SD 8 Gen1 5G
  Status
  affected
  Constraints
  -
- Version
  SD855
  Status
  affected
  Constraints
  -
- Version
  SM4450
  Status
  affected
  Constraints
  -
- Version
  SW5100
  Status
  affected
  Constraints
  -
- Version
  SW5100P
  Status
  affected
  Constraints
  -
- Version
  Snapdragon 8 Gen 1 Mobile Platform
  Status
  affected
  Constraints
  -
- Version
  Snapdragon 8+ Gen 1 Mobile Platform
  Status
  affected
  Constraints
  -
- Version
  Snapdragon 855 Mobile Platform
  Status
  affected
  Constraints
  -
- Version
  Snapdragon 855+/860 Mobile Platform (SM8150-AC)
  Status
  affected
  Constraints
  -
- Version
  Snapdragon 888 5G Mobile Platform
  Status
  affected
  Constraints
  -
- Version
  Snapdragon 888+ 5G Mobile Platform (SM8350-AC)
  Status
  affected
  Constraints
  -
- Version
  Snapdragon W5+ Gen 1 Wearable Platform
  Status
  affected
  Constraints
  -
- Version
  Snapdragon Wear 4100+ Platform
  Status
  affected
  Constraints
  -
- Version
  WCD9341
  Status
  affected
  Constraints
  -
- Version
  WCD9370
  Status
  affected
  Constraints
  -
- Version
  WCD9380
  Status
  affected
  Constraints
  -
- Version
  WCD9385
  Status
  affected
  Constraints
  -
- Version
  WCN3610
  Status
  affected
  Constraints
  -
- Version
  WCN3660B
  Status
  affected
  Constraints
  -
- Version
  WCN3680B
  Status
  affected
  Constraints
  -
- Version
  WCN3950
  Status
  affected
  Constraints
  -
- Version
  WCN3980
  Status
  affected
  Constraints
  -
- Version
  WCN3988
  Status
  affected
  Constraints
  -
- Version
  WCN6740
  Status
  affected
  Constraints
  -
- Version
  WSA8810
  Status
  affected
  Constraints
  -
- Version
  WSA8815
  Status
  affected
  Constraints
  -
- Version
  WSA8830
  Status
  affected
  Constraints
  -
- Version
  WSA8832
  Status
  affected
  Constraints
  -
- Version
  WSA8835
  Status
  affected
  Constraints
  -

Default status is the baseline for the product, each version can override it (e.g. patched versions marked unaffected).

Vendor

Product

Default status

Versions

Qualcomm, Inc.

Snapdragon

unaffected

Version	Status	Constraints
AQT1000	affected	-
FastConnect 6200	affected	-
FastConnect 6700	affected	-
FastConnect 6900	affected	-
FastConnect 7800	affected	-
QAM8255P	affected	-
QCA6420	affected	-
QCA6430	affected	-
QCA6574AU	affected	-
QCA6595AU	affected	-
QCA6698AQ	affected	-
QCA6797AQ	affected	-
QCS8155	affected	-
SA6155P	affected	-
SA8155P	affected	-
SA8195P	affected	-
SA8255P	affected	-
SD 8 Gen1 5G	affected	-
SD855	affected	-
SM4450	affected	-
SW5100	affected	-
SW5100P	affected	-
Snapdragon 8 Gen 1 Mobile Platform	affected	-
Snapdragon 8+ Gen 1 Mobile Platform	affected	-
Snapdragon 855 Mobile Platform	affected	-
Snapdragon 855+/860 Mobile Platform (SM8150-AC)	affected	-
Snapdragon 888 5G Mobile Platform	affected	-
Snapdragon 888+ 5G Mobile Platform (SM8350-AC)	affected	-
Snapdragon W5+ Gen 1 Wearable Platform	affected	-
Snapdragon Wear 4100+ Platform	affected	-
WCD9341	affected	-
WCD9370	affected	-
WCD9380	affected	-
WCD9385	affected	-
WCN3610	affected	-
WCN3660B	affected	-
WCN3680B	affected	-
WCN3950	affected	-
WCN3980	affected	-
WCN3988	affected	-
WCN6740	affected	-
WSA8810	affected	-
WSA8815	affected	-
WSA8830	affected	-
WSA8832	affected	-
WSA8835	affected	-

Remediation

No remediation recorded yet.

Weaknesses (1)

CWE-416

Use After Free

References (1)

https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin
Vendor Advisory

Link	Providers	Tags
https://www.qualcomm.com/company/product-security/bulletins/june-2023-bulletin		Vendor Advisory

Change history (0)

No recorded changes yet.

Sources

CVE.org / MITRE

Status PUBLISHED

Assigner qualcomm

Published Jun 6, 2023

Updated Jan 7, 2025

Reserved Jun 14, 2022

Link CVE-2022-33263

CISA Vulnrichment

Updated Jan 7, 2025

NVD

Status Modified

Modified Jun 17, 2026

Link CVE-2022-33263

Red Hat

Severity n/a

Public date n/a

Links CVE-2022-33263