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HIGH

Close and bind operations done on a socket can lead to a Use-After-Free condition

Published Jul 30, 2020

Description

Close and bind operations done on a socket can lead to a Use-After-Free condition. in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8053, APQ8096AU, APQ8098, MDM9206, MDM9207C, MDM9607, MDM9640, MDM9650, MSM8905, MSM8909W, MSM8996, MSM8996AU, QCN7605, QCN7606, QCS605, SC8180X, SDA660, SDA845, SDM439, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDX20, SDX24, SDX55, SM8150, SXR1130

Affected products

Remediation

No remediation recorded yet.

Weaknesses (1)

References (2)

Change history (0)

No recorded changes yet.

Sources
CVE.org / MITRE
Status PUBLISHED
Assigner qualcomm
Published Jul 30, 2020
Updated Aug 5, 2024
Reserved Jul 19, 2019
NVD
Status Modified
Modified Jun 17, 2026
Red Hat
Severity n/a
Public date n/a