HIGH
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820
Published Oct 23, 2018
7.8
HIGHCVSS 3.0
EPSS 0.26%
Description
Double memory free while closing TEE SE API Session management in Snapdragon Mobile in version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820.
Affected products
-
- Version SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820StatusaffectedConstraints-
- Version
Default status is the baseline for the product, each version can override it (e.g. patched versions marked unaffected).
| Vendor | Product | Default status | Versions | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Mobile | n/a |
|
Configuration 1
AND
- n/a
Configuration 2
AND
- n/a
Configuration 3
AND
- n/a
Configuration 4
AND
- n/a
Configuration 5
AND
- n/a
Configuration 6
AND
- n/a
Configuration 7
AND
- n/a
No data.
No Red Hat product state for this CVE.
No package ranges for this CVE.
Remediation
No remediation recorded yet.
Weaknesses (1)
References (3)
- http://www.securitytracker.com/id/1041432 vdb-entryx_refsource_SECTRACKThird Party AdvisoryVDB Entry
- https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components x_refsource_CONFIRMThird Party Advisory
- https://www.qualcomm.com/company/product-security/bulletins x_refsource_CONFIRMVendor Advisory
| Link | Providers | Tags |
|---|---|---|
| http://www.securitytracker.com/id/1041432 | vdb-entryx_refsource_SECTRACKThird Party AdvisoryVDB Entry | |
| https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components | x_refsource_CONFIRMThird Party Advisory | |
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRMVendor Advisory |
Change history (0)
No recorded changes yet.
Sources
CVE.org / MITRE
Status PUBLISHED
Assigner qualcomm
Published Oct 23, 2018
Updated Aug 5, 2024
Reserved Jun 15, 2018
Link CVE-2017-18297
CISA Vulnrichment
Updated n/a