A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20
Published May 6, 2019
7.8
HIGHCVSS 3.0
EPSS 0.24%
Description
A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.
Affected products
- Vendor Qualcomm Technologies, Inc. Product Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear Defaultn/a
- Version MDM9206StatusaffectedConstraints-
- Version MDM9607StatusaffectedConstraints-
- Version MDM9650StatusaffectedConstraints-
- Version MSM8909WStatusaffectedConstraints-
- Version MSM8996AUStatusaffectedConstraints-
- Version SD 210/SD 212/SD 205StatusaffectedConstraints-
- Version SD 425StatusaffectedConstraints-
- Version SD 450StatusaffectedConstraints-
- Version SD 615/16/SD 415StatusaffectedConstraints-
- Version SD 625StatusaffectedConstraints-
- Version SD 650/52StatusaffectedConstraints-
- Version SD 820StatusaffectedConstraints-
- Version SD 820AStatusaffectedConstraints-
- Version SD 835StatusaffectedConstraints-
- Version SD 845StatusaffectedConstraints-
- Version SDX20StatusaffectedConstraints-
- Version
Default status is the baseline for the product, each version can override it (e.g. patched versions marked unaffected).
| Vendor | Product | Default status | Versions | |||||||||||||||||||||||||||||||||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Qualcomm Technologies, Inc. | Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear | n/a |
|
Configuration 1
- n/a
Configuration 2
- n/a
Configuration 3
- n/a
Configuration 4
- n/a
Configuration 5
- n/a
Configuration 6
- n/a
Configuration 7
- n/a
Configuration 8
- n/a
Configuration 9
- n/a
Configuration 10
- n/a
Configuration 11
- n/a
Configuration 12
- n/a
Configuration 13
- n/a
Configuration 14
- n/a
Configuration 15
- n/a
Configuration 16
- n/a
Configuration 17
- n/a
Configuration 18
- n/a
Configuration 19
- n/a
Configuration 20
- n/a
Configuration 21
- n/a
No data.
No Red Hat product state for this CVE.
No package ranges for this CVE.
Remediation
No remediation recorded yet.
Metrics
No CVSS v4.0 score for this CVE.
No CVSS v3.1 score for this CVE.
CVSS:3.0/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
AV:L/AC:L/Au:N/C:C/I:C/A:C
This CVE is not in the KEV list.
No CISA SSVC assessment for this CVE yet.
Estimated probability of exploitation in the wild in the next 30 days (FIRST EPSS). As of Oct 1, 2026.
Score over time
2021–2026- EPSS v1
- EPSS v5
- EPSS v2
- EPSS v3
Percentile over time
- EPSS v1
- EPSS v5
- EPSS v2
- EPSS v3
Table of values (9 key points)
Flat stretches are collapsed; showing up to 120 newest points.
| Date | Score | Percentile | Model |
|---|---|---|---|
| Oct 1, 2026 | 0.24% (0.00243) | 14.00th | v5 (v2026.06.15) |
| Sep 20, 2026 | 0.24% (0.00243) | 15.79th | v5 (v2026.06.15) |
| Jul 20, 2024 | 0.04% (0.00044) | 12.95th | v3 (v2023.03.01) |
| May 25, 2024 | 0.04% (0.00044) | 12.27th | v3 (v2023.03.01) |
| Mar 7, 2023 | 0.04% (0.00044) | 10.26th | v3 (v2023.03.01) |
| Mar 6, 2023 | 0.89% (0.00885) | 27.89th | v2 (v2022.01.01) |
| Feb 4, 2022 | 0.89% (0.00885) | 10.50th | v2 (v2022.01.01) |
| Feb 3, 2022 | 0.42% (0.00416) | 10.04th | v5 (v2026.06.15) |
| Apr 14, 2021 | 0.42% (0.00416) | 0.00th | v1 |
References (1)
- https://www.qualcomm.com/company/product-security/bulletins x_refsource_CONFIRMVendor Advisory
| Link | Providers | Tags |
|---|---|---|
| https://www.qualcomm.com/company/product-security/bulletins | x_refsource_CONFIRMVendor Advisory |
Change history (0)
No recorded changes yet.